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Détails du poste

icspi is building the future of nanoscale imaging. We’ve revolutionized atomic force microscopy (AFM) by miniaturizing it by a factor of 1,000,000x compared to traditional systems: integrating all the components of an AFM onto a single CMOS chip, which we call microAFM. Our core tech is field-proven and used by scientists and engineers in over 40 countries. Now we are using our core tech to solve throughput-resolution gaps in the semiconductor industry: catching nanoscale defects to enable new processes and prolong Moore's Law. Today, scanning a wafer with AFM would take about 70 years. By using thousands of microAFMs in parallel, we can scan a wafer in a matter of hours. About the role As Semiconductor (MEMS) Manufacturing Engineer at icspi, you will work on manufacturing technology from CMOS to MEMS processing to packaging to enable entirely new nanoscale imaging technology. We are looking for a knowledgeable and detail-oriented engineer with a broad skill set across microfabrication and packaging. You will play a critical role in working with our foundry and OSAT partners to develop, integrate and optimize manufacturing processes to scale our unique MEMS-based AFM technology to drive industry-leading performance and capability. We are fabless and less than 10% of time is expected to be hands-on in the cleanroom. Work includes defining process requirements, co-developing and reviewing proposals and DOEs, analyzing data and continuously improving yield and reliability. The ideal candidate is a self-starter who uses first principles thinking, has hands-on experience in the cleanroom (from design, fab to packaging), and has managed suppliers (foundry and OSAT). We are a small team and you will have a lot of ownership of your projects. What you’ll do Own end-to-end process definition for our MEMS-based AFM devices and probe tips - from CMOS to MEMS processing to packaging Lead supplier engagement: define process requirements and specifications for our foundry and OSAT partners, co-develop DOEs and processes, select materials, execute on continuous improvement (yield and reliability) <10% hands-on in the cleanroom (packaging, metrology, microfabrication) Travel typically <10%, may be up to 25% during transfer/bring-up Required experience Bachelor’s Degree or higher in engineering (chemical, materials, nanotechnology, mechanical, electrical or engineering physics), physics or material science 3+ years of experience in cleanroom (lithography, deposition, etch) and packaging (wire bonding, wafer bonding), strong understanding of end-to-end processing Hands-on metrology experience (e.g., optical, SEM, interferometry) Strong analytical and problem-solving skills, with the ability to troubleshoot complex microfabrication issues remotely, diagnosing root cause from supplier data Demonstrated success with DOE and yield/failure analysis, ideally on a production process

Ce que vous ferez

The engineer will own the end-to-end process definition for MEMS-based AFM devices, spanning CMOS processing to packaging. They will lead engagement with foundry and OSAT partners to optimize manufacturing processes, yield, and reliability.

Exigences

Requires a Bachelor's degree or higher in a relevant engineering or physics field with 3+ years of cleanroom and packaging experience. Candidates must have strong analytical skills for troubleshooting microfabrication issues and experience with DOE and metrology tools.

Compétences indiquées

• Packaging · Souhaitée

Autres compétences pertinentes

Relevées dans la description du poste. Confirmez les exigences importantes ci-dessus.

• MEMS Processing
• CMOS
• Microfabrication
• Packaging
• Lithography
• Deposition
• Etch
• Wire Bonding
• Wafer Bonding
• Metrology
• SEM
• Interferometry
• DOE
• Yield Analysis
• Failure Analysis
• Supplier Management

Domaines d’emploi

• Engineering
• Manufacturing
• Science & Research
• Technology